Note: The bonafide certificate from the institute will be required only for the students selected for second round. This is not required for the initial submission.
Call for Design Contest
APCCAS 2023 and PRIME Asia 2023 are holding an International Design Contest to provide a platform to showcase innovative hardware and software solutions to real-world problems.
Theme of the Contest
The theme of the Design Contest is aligned with the conference theme of ‘Safe, Secure, Smart Circuits and Systems for a Sustainable Society’. It is expected to involve a hardware/software co-designed solution using an FPGA, making use of hardware acceleration. You will be showcasing design approaches and solutions in the areas/domains of AI/ML, IoT, Industrial Automation, Automotive, Healthcare, Environment, Clean Energy, etc.
Important Dates:
- Idea Submission : Closed
- Acceptance Notification : Sent to Selected Participants
- Acknowledgment of conference participation : 15 Aug 2023
- Hardware Kit Distribution : 16 Aug 2023
- Presentation : 19-22 Nov 2023
Hardware Platform
The hardware platform to be used is Microchip Technology’s RISC-V based PolarFire SoC. This will be made available to the shortlisted teams.
The PolarFire SoC Icicle Kit Features an MPFS250T SoC FPGA with two RJ45 connectors for 10/100/1000 Mbps Ethernet, LPDDR4 memory, PCIe Root Port, 40-pin Raspberry Pi 4 interface connector and mikroBUS expansion port.
More information, quick-start guides, documentation, and example programs can be found at https://github.com/polarfire-soc
Eligibility
Participants should be bonafide undergraduate or postgraduate (including PhD) students in a discipline of interest to the IEEE. A team can have mentors who are not students, but the lead author(s) and presenter(s) should be students.
Prizes
Prizes will be announced at a later stage.
Stage-1: Idea Submission
Your idea submission should cover:
- A summary as well as a detailed description of the idea along with a block diagram.
- Benefits and value addition of your solution and application scenarios.
- Your team description along with your contact information and postal address.
Steps for submission
Following the first round of screening, shortlisted teams will convert their ideas into applications/solutions using the PolarFire SoC Icicle Kit. Hardware kits will be shipped to the selected teams.
Stage-2 : Implementation
Implementation should be on the Microchip Technology PolarFire SoC Icicle Kit provided. Training materials and support will be provided for this platform.
Publication in PRIME Asia
Participants shortlisted for Stage-2 are invited to submit their work as IEEE PRIME Asia papers selecting the special session “Student Design Contest”. The papers will be regularly reviewed and, if accepted, must be presented at IEEE PRIME Asia 2023
Contact
Email：For questions contact: apccas2023designcontest@gmail.com